Is a process similar to brazing however the liquidous of the filler metal and process temperature is below 842°F. The solder filler metal can be either pre-placed or fed into the joint depending on the joint configuration. Much like brazing capillary action is critical for the success of this process and this principle is achieved by having the appropriate joint clearances that will provide the solder filler metal the ability to be drawn into and through the joint. Soldering Flux is used to protect the parent materials from oxidizing during this low temperature metal joining process.